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Henchman Products Pty Ltd
8 Pavilion Place
Cardiff, NSW 2285
AUSTRALIA

Tel: +61 2 4956 7111
Fax: +61 2 4956 7811
Email: sales@henchman.com.au
Web: https://www.henchman.com.au/

Special
Kester Solder Flux Gel

Kester Solder Flux Gel

Product Code: RF741-30G

$AUD 50.82(ex GST)

In Stock

 


Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework and repair applications. Kester RF741 has a gel-like consistency and is easily applied by syringe dispensing. Kester RF741 can be precisely dispensed onto a specific area that needs flux. After being dispensed, Kester RF741 stays in place until soldering occurs. Traditional problems experienced with controlling the application of low solids no-clean liquid fluxes are eliminated. Kester RF741 has excellent performance in applications requiring a flux having good thermal stability such as surface mount component repair. Kester RF741 is the ideal choice for QFP or BGA semi-automated rework operations. In addition, RF741 is well suited for use with through-hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are almost colorless, leaving a very cosmetically appealing repair. The residue has high electrical resistance and can be left on the assembly after soldering. Residues are compatible with all no-clean fluxes in the Kester product line. Kester RF741 can be used in combinations with Kester no-clean cored wire solders and no-clean solder pastes, as well as no-clean liquid fluxes without any compatibility risks.

 Specifications

  • DG

Category: Flux Gel

Brand: Kester Solder



Kester Solder Flux Gel

Product Code: RF741-30G

Category: Solder, Wicks & Fluxes / Flux / Flux Gel

Price: $AUD 50.82 (ex GST)

Brand: Kester Solder

Weight: 0

Description:
Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework and repair applications. Kester RF741 has a gel-like consistency and is easily applied by syringe dispensing. Kester RF741 can be precisely dispensed onto a specific area that needs flux. After being dispensed, Kester RF741 stays in place until soldering occurs. Traditional problems experienced with controlling the application of low solids no-clean liquid fluxes are eliminated. Kester RF741 has excellent performance in applications requiring a flux having good thermal stability such as surface mount component repair. Kester RF741 is the ideal choice for QFP or BGA semi-automated rework operations. In addition, RF741 is well suited for use with through-hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are almost colorless, leaving a very cosmetically appealing repair. The residue has high electrical resistance and can be left on the assembly after soldering. Residues are compatible with all no-clean fluxes in the Kester product line. Kester RF741 can be used in combinations with Kester no-clean cored wire solders and no-clean solder pastes, as well as no-clean liquid fluxes without any compatibility risks.