JBC Nano Rework Station with Handpiece and Tweezer

JBC NASE-2C Nano Rework Station with NT115 Handpiece and AN115 Tweezer 230V

Features

• Nano rework station 230 volt - not for use in the US
• Includes NT115-A handpiece and AN115-A tweezer
• Ideal for work with very small-sized components requiring the highest precision, including 0402, 0201 and 01005
• The short distance from the tip to the handle offers maximum control, even when using a microscope
• The NASE-C comes with the new Temperature Dynamic Profiles functionality
• Uses C115 tips - sold seperately

The JBC Nano NASE-2C is a two-channel rework system, designed for use with extremely small surface mount components, including 0402, 0201 and 01005. The NASE-2C includes the NT115-A handpiece and AN115-A tweezer, as well as several tips.

NT115-A Nano handle
The NT115-A is an extremely precise handle, designed specifically for use with the Nano system. Its short tip to grip distance enables greater manual control of the tool, including while a microscope is being used. The NT115-A comes with a soft grip for comfortable usage and to prevent fingers from sliding.

AN115-A adjustable tweezers?
The AN115-A is JBC's smallest adjustable tweezer, providing high precision while soldering and reworking surface mount components. The AN115-A vertical cartridge alignment offers an easy to use adjustment system to ensure your cartridges are aligned properly. A single axis system also helps guide and steady the hand for use in very precise applications, as does the short tip to grip distance.

Rework components with Dynamic Soldering Profiles
JBC Soldering introduces the final solution for reworking thermal shock sensitive components like MLCC capacitors: Dynamic Soldering Profiles for hand soldering tools.

Now, by combining the new Dynamic Temperature Profile functionality with the most precise JBC rework tools, it is possible to reliably rework MLCC capacitors as small as 008004 and other thermal shock sensitive components individually eliminating the risk of disturbing nearby components.

The use of these profiles allows you to control the temperature of the component during all the phases of the soldering process, emulating the heating process in a reflow oven.